Die-attach Materials: Semiconductor Industry Opens up Growth Avenues in Market
Noteworthy vendors in the global market for die-attach materials that are impacting its competitive contours big time are Dow Corning Corporation,
Transparency Market Research in one of its recent research study on the die-attach materials market finds that it would rise steadily at a 3.1% CAGR over the course of the forecast period starting from 2017 and ending in 2026. At this rate, it projects the market to reach a value of US$970 mn by the end of 2026.
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Depending upon the form of die-attach materials, the paste-based ones will likely see soaring uptake in the next couple of years. Geography-wise, Asia-Pacific excluding Japan (APEJ) accounts for the biggest market share. In the years ahead too, the region is predicted to retain its dominant share. In fact, the region powered by China and South Korea, which are major producers of die-attach materials, is expected to mainly impact the trajectory of the market. The TMR report predicts the region to generate about 70% of the revenue in the overall die-attach materials market by 2026-end.
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Semiconductor Industry Opens up Growth Avenues in Market
At the forefront of driving the market for die-attach materials is the spiking demand for consumer electronics. Die-attach materials are an integral part of the electrical circuit boards used in such consumer electronics. Elaborating it, the lead analyst of the TMR report adds, “The progressing semiconductor industry has generated new areas for usage of electronic components in a wide variety of devices. With growing usage of electronic chips and chipsets, die-attach materials are seeing a massive rise in demand. High thermal conductivity, low-temperature sintering, high electrical conductivity, and low costs are main factor driving sales of die-attach materials worldwide.”
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